3DIC: Wafer Production Goes 3D
In microelectronics, a three-dimensional integrated circuit (3D IC, 3D-IC, or 3-D IC) is a chip in which two or more layers of active electronic components are integrated vertically and horizontally. The semiconductor industry, represented by the international industry association SEMI, is actively motivating all members to increase research and collaboration to push this promising technology.
3DIC offers higher levels of functionality, circuit density and smaller footprints. Beside reduced space requirements, these 3D-packages offer better performance because the interconnection length and therefore the electrical signal ways can be drastically shortened.
